Patent Assignment
Reel/Frame 053885/0470
Assignment of Assignor's Interest
Recorded: 2020-09-25
Pages: 4
Assignors
BEAK, WOONJAE
Executed: 2020-09-23
KIM, MINSU
Executed: 2020-09-23
LEE, HEESOO
Executed: 2020-09-23
Assignee
STATS CHIPPAC PTE. LTD.
5 YISHUN STREET 23, SINGAPORE, 768442, SINGAPORE
Covered Property
(1)
Semiconductor Device and Method of Providing High Density Component Spacing
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.