IP Library › Assignment 053894/0464
Patent Assignment
Reel/Frame 053894/0464

Assignment of Assignor's Interest

Recorded: 2020-09-26 Pages: 6
Assignors
CHUNG, JISOO
Executed: 2020-09-14
LEE, KANG-WON
Executed: 2020-09-14
HWANG, SUNG-MIN
Executed: 2020-09-14
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property (1)
Three-Dimensional Semiconductor Memory Device
Application: 17/027,734 →
Publication: US 2021/0265271