IP Library Assignment 053894/0518
Patent Assignment
Reel/Frame 053894/0518

Assignment of Assignor's Interest

Recorded: 2020-09-27 Pages: 43
Assignor
AMKOR TECHNOLOGY, INC.
Executed: 2019-01-01
Assignee
AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD.
491B RIVER VALLEY ROAD, VALLEY POINT #12-03, 248373, SINGAPORE
Covered Property (1)
Method of Forming a Packaged Semiconductor Device Using Ganged Conductive Connective Assembly and Structure
Application: 16/049,735 →
Publication: US 2018/0350735
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jul 30, 2018
From: YEO, SIANG MIANG; ZULKIFLI, MOHD HASRUL BIN
To: AMKOR TECHNOLOGY, INC.
Reel/Frame 046505/0944 →
Assignment of Assignor's Interest Oct 12, 2020
From: AMKOR TECHNOLOGY, INC.
To: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE.LTD.
Reel/Frame 054046/0673 →