Patent Assignment
Reel/Frame 053922/0089
Assignment of Assignor's Interest
Recorded: 2020-09-29
Pages: 7
Assignors
PARK, JUNG-HO
Executed: 2020-09-16
PARK, JIN-WOO
Executed: 2020-09-16
LEE, SEOK HYUN
Executed: 2020-09-16
JANG, JAE GWON
Executed: 2020-09-16
JEON, GWANG JAE
Executed: 2020-09-16
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO,, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Method for Fabricating Semiconductor Package