Patent Assignment
Reel/Frame 053938/0177
Assignment of Assignor's Interest
Recorded: 2020-09-30
Pages: 2
Assignors
LIN, BO-JIUN
Executed: 2020-09-15
LIN, YU CHAO
Executed: 2020-09-15
LEE, TUNG YING
Executed: 2020-09-15
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Interconnect Structure and Method