Patent Assignment
Reel/Frame 053940/0493
Assignment of Assignor's Interest
Recorded: 2020-09-30
Pages: 7
Assignors
DING, SHAOFENG
Executed: 2020-09-17
KANG, MINGUK
Executed: 2020-09-17
KIM, JIHYUNG
Executed: 2020-09-18
AHN, JEONG HOON
Executed: 2020-09-18
YOO, HAERI
Executed: 2020-09-17
CHOI, YUN KI
Executed: 2020-09-18
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Device and Stacked Semiconductor Chips Including Through Contacts