IP Library › Assignment 053944/0699
Patent Assignment
Reel/Frame 053944/0699

Assignment of Assignor's Interest

Recorded: 2020-10-01 Pages: 6
Assignors
SONG, JONGSUP
Executed: 2020-06-22
CHOI, SEOLYOUNG
Executed: 2020-06-22
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, GYEONGGI-DO, SUWON-SI, 16677, KOREA, REPUBLIC OF
Covered Property (1)
Wiring Board and Electronic Device Module
Application: 17/060,248 →
Publication: US 2021/0242118