Patent Assignment
Reel/Frame 053945/0206
Assignment of Assignor's Interest
Recorded: 2020-10-01
Pages: 12
Assignors
DAS MAHAPATRA, SUSMRITI
Executed: 2020-09-22
SANKARASUBRAMANIAN, MALAVARAYAN
Executed: 2020-09-24
HOWELL, SHENAVIA
Executed: 2020-09-24
HARPER, JOHN
Executed: 2020-09-24
MODI, MITUL
Executed: 2020-09-22
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BLVD., SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Chip-Scale Package Architectures Containing a Die Back Side Metal and a Solder Thermal Interface Material