IP Library Assignment 053947/0343
Patent Assignment
Reel/Frame 053947/0343

Assignment of Assignor's Interest

Recorded: 2020-10-01 Pages: 2
Assignors
CHEN, SZU-YING
Executed: 2020-07-07
SYUE, SEN-HONG
Executed: 2020-07-07
CHANG, HUICHENG
Executed: 2020-07-07
YEO, YEE-CHIA
Executed: 2020-07-10
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6 HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property (1)
Shallow Trench Isolation Forming Method and Structures Resulting Therefrom
Application: 16/917,159 →
Publication: US 2021/0407847