Patent Assignment
Reel/Frame 053959/0699
Assignment of Assignor's Interest
Recorded: 2020-10-02
Pages: 4
Assignor
MACELWEE, THOMAS
Executed: 2019-04-29
Assignee
GAN SYSTEMS INC.
1145 INNOVATION DR, OTTAWA, K2K 3G8, CANADA
Covered Property
(1)
Embedded Packaging for High Voltage, High Temperature Operation of Power Semiconductor Devices
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.