Patent Assignment
Reel/Frame 053972/0810
Assignment of Assignor's Interest
Recorded: 2020-10-05
Pages: 5
Assignors
LEE, HYUN A
Executed: 2020-04-07
PARK, CHAN-JAE
Executed: 2020-04-07
WOO, HEEJU
Executed: 2020-04-07
YOUK, KIKYUNG
Executed: 2020-04-07
LEE, SANGDUK
Executed: 2020-04-07
JANG, DAEHWAN
Executed: 2020-04-07
Assignee
SAMSUNG DISPLAY CO., LTD.
1, SAMSUNG-RO, GIHEUNG-GU, YONGIN-SI, GYEONGGI-DO, 17113, KOREA, REPUBLIC OF
Covered Property
(1)
Ultrasonic Bonding Apparatus and Ultrasonic Bonding Method Using the Same