Patent Assignment
Reel/Frame 053977/0993
Assignment of Assignor's Interest
Recorded: 2020-10-05
Pages: 4
Assignee
ADVANCED SEMICONDUCTOR ENGINEERING, INC.
26 CHIN 3RD ROAD, NANTZE EXPORT PROCESSING ZONE, KAOHSIUNG, TAIWAN
Covered Property
(1)
Semiconductor Package Structure, Electronic Device, and Method for Manufacturing the Same