Patent Assignment
Reel/Frame 054009/0089
Assignment of Assignor's Interest
Recorded: 2020-10-08
Pages: 10
Assignors
POWNEY, DAVID
Executed: 2020-09-17
SAARINEN, ILKKA
Executed: 2020-09-28
KYLKILAHTI, MIKKO
Executed: 2020-09-29
HAN, LEI
Executed: 2020-09-16
Assignee
HUAWEI TECHNOLOGIES CO., LTD.
HUAWEI ADMINISTRATION BUILDING, BANTIAN, LONGGANG DISTRICT, GUANGDONG, SHENZHEN, 518129, CHINA
Covered Property
(1)
Flex on Board Anisotropic Conductive Adhesive Interconnection