Patent Assignment
Reel/Frame 054028/0172
Assignment of Assignor's Interest
Recorded: 2020-10-12
Pages: 4
Assignors
BRAGANCA, WAGNO ALVES, JR.
Executed: 2020-10-05
KIM, KYUNGOE
Executed: 2020-10-05
LEE, TAEKEUN
Executed: 2020-10-05
Assignee
STATS CHIPPAC PTE. LTD.
5 YISHUN STREET 23, SINGAPORE, 768442, SINGAPORE
Covered Property
(1)
Die-Beam Alignment for Laser-Assisted Bonding
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.