Patent Assignment
Reel/Frame 054031/0613
Assignment of Assignor's Interest
Recorded: 2020-10-12
Pages: 5
Assignor
INTEL IP CORPORATION
Executed: 2020-10-09
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95054
Covered Properties
(4)
Stress Buffer Layer for Integrated Microelectromechanical Systems (Mems)
Stress Buffer Layer for Integrated Microelectromechanical Systems (Mems)
Redistribution Layer Lines
Redistribution Layer Lines
Application:
15/677,835 →
Publication:
US 2018/0068939
Related Assignments
(6)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Feb 19, 2014
From: GEISSLER, CHRISTIAN; MEYER, THORSTEN; OFNER, GERALD; MAHNKOPF, REINHARD
To: INTEL IP CORPORATION
Reel/Frame 032245/0187 →
Assignment of Assignor's Interest
Sep 3, 2015
From: GEISSLER, CHRISTIAN; MEYER, THORSTEN; OFNER, GERALD; MAHNKOPF, REINHARD
To: INTEL IP CORPORATION
Reel/Frame 036490/0412 →
Assignment of Assignor's Interest
Feb 24, 2016
From: REINGRUBER, KLAUS; ALBERS, SVEN; GEISSLER, CHRISTIAN
To: INTEL IP CORPORATION
Reel/Frame 037818/0126 →
Assignment of Assignor's Interest
Oct 12, 2020
From: REINGRUBER, KLAUS; ALBERS, SVEN; GEISSLER, CHRISTIAN
To: INTEL IP CORPORATION
Reel/Frame 054031/0360 →
Assignment of Assignor's Interest
Oct 12, 2020
From: GEISSLER, CHRISTIAN; MEYER, THORSTEN; OFNER, GERALD; MAHNKOPF, REINHARD
To: INTEL IP CORPORATION
Reel/Frame 054031/0510 →
Assignment of Assignor's Interest
Dec 16, 2020
From: INTEL CORPORATION
To: GOOGLE LLC
Reel/Frame 054772/0918 →