Patent Assignment
Reel/Frame 054032/0385
Assignment of Assignor's Interest
Recorded: 2020-10-12
Pages: 4
Assignors
LIN, BO-JIUN
Executed: 2020-09-15
LEE, TUNG-YING
Executed: 2020-09-15
LIN, YU-CHAO
Executed: 2020-09-15
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Method of Forming Interconnect Structure