Patent Assignment
Reel/Frame 054048/0729
Assignment of Assignor's Interest
Recorded: 2020-10-14
Pages: 6
Assignors
PARK, YUKYUNG
Executed: 2020-05-07
KIM, UNGCHEON
Executed: 2020-05-07
PARK, SUNGWOO
Executed: 2020-05-07
RYU, SEUNGKWAN
Executed: 2020-05-11
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Interposer, Semiconductor Package Including the Same, and Method of Fabricating the Interposer