Patent Assignment
Reel/Frame 054058/0174
Assignment of Assignor's Interest
Recorded: 2020-10-15
Pages: 4
Assignor
LU, WEN-LONG
Executed: 2020-08-20
Assignee
ADVANCED SEMICONDUCTOR ENGINEERING, INC.
26 CHIN 3RD ROAD, NANTZE EXPORT PROCESSING ZONE, KAOHSIUNG, TAIWAN
Covered Property
(1)
Semiconductor Device Package and Method of Manufacturing the Same