Patent Assignment
Reel/Frame 054062/0424
Assignment of Assignor's Interest
Recorded: 2020-10-15
Pages: 3
Assignors
JUNG, CHUNGHYO
Executed: 2020-09-10
LIM, JAEDEOK
Executed: 2020-09-10
PARK, HYEIN
Executed: 2020-09-10
YOU, JAEHYOUNG
Executed: 2020-09-10
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Electronic Device Including Heat Radiating Structure