Patent Assignment
Reel/Frame 054076/0424
Assignment of Assignor's Interest
Recorded: 2020-10-16
Pages: 4
Assignor
NODA, SEINA
Executed: 2020-10-09
Assignee
MITSUBISHI MATERIALS CORPORATION
2-3, MARUNOUCHI 3-CHOME, CHIYODA-KU, TOKYO, 100-8117, JAPAN
Covered Property
(1)
Packaging Method for Polycrystalline Silicon, Double-Packaging Method for Polycrystalline Silicon, and Producing Method of Raw Material for Monocrystalline Silicon
Application:
17/048,242 →
Publication:
US 2021/0070484
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.