Patent Assignment
Reel/Frame 054079/0497
Assignment of Assignor's Interest
Recorded: 2020-10-16
Pages: 9
Assignor
COMPONENT RE-ENGINEERING COMPANY, INC.
Executed: 2020-08-07
Assignee
WATLOW ELECTRIC MANUFACTURING COMPANY
12001 LACKLAND ROAD, ST. LOUIS, MISSOURI, 63146
Covered Property
(1)
Low Temperature Method for Hermetically Joining Non-Diffusing Ceramic Materials in Multi-Layer Plate Devices
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Jan 11, 2019
From: ELLIOT, ALFRED GRANT; ELLIOT, BRENT DONALD ALFRED; BALMA, FRANK; SCHUSTER, RICHARD ERICH
To: COMPONENT RE-ENGINEERING COMPANY, INC.
Reel/Frame 047977/0822 →
Patent Security Agreement (Short Form)
Mar 3, 2021
From: WATLOW ELECTRIC MANUFACTURING COMPANY
To: BANK OF MONTREAL, AS ADMINISTRATIVE AGENT
Reel/Frame 055479/0708 →