Patent Assignment
Reel/Frame 054098/0382
Assignment of Assignor's Interest
Recorded: 2020-10-19
Pages: 3
Assignors
CHEN, MING-FA
Executed: 2020-09-21
CHEN, CHENG-FENG
Executed: 2020-09-21
YEH, SUNG-FENG
Executed: 2020-09-21
CHENG, CHUAN-AN
Executed: 2020-09-21
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Multi-Level Stacking of Wafers and Chips