Patent Assignment
Reel/Frame 054127/0664
Assignment of Assignor's Interest
Recorded: 2020-10-21
Pages: 3
Assignors
HONG, SEOK YOON
Executed: 2020-10-08
PARK, SEOHYUN
Executed: 2020-10-08
KWON, HYUKKI
Executed: 2020-10-08
PARK, HANSU
Executed: 2020-10-08
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
MAEYOUNG-RO 150 (MAETAN-DONG), YOUNGTONG-GU, GYEONGGI-DO, SUWON-SI, 16674, KOREA, REPUBLIC OF
Covered Property
(1)
Electronic Device Package and Method of Manufacturing Electronic Device Package