IP Library › Assignment 054136/0685
Patent Assignment
Reel/Frame 054136/0685

Assignment of Assignor's Interest

Recorded: 2020-10-22 Pages: 5
Assignors
HE, XIAOGUANG
Executed: 2020-10-15
NAGARAJAN, RADHAKRISHNAN L.
Executed: 2020-10-18
Assignee
INPHI CORPORATION
110 RIO ROBLES, SAN JOSE, CALIFORNIA, 95134
Covered Property (1)
Laser Chip for Flip-Chip Bonding on Silicon Photonics Chips
Application: 17/076,162 →
Publication: US 2022/0123518
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jun 23, 2021
From: INPHI CORPORATION
To: MARVELL TECHNOLOGY CAYMAN I
Reel/Frame 056649/0823 →
Assignment of Assignor's Interest Jun 25, 2021
From: MARVELL TECHNOLOGY CAYMAN I
To: CAVIUM INTERNATIONAL
Reel/Frame 057279/0519 →
Assignment of Assignor's Interest Aug 27, 2021
From: CAVIUM INTERNATIONAL
To: MARVELL ASIA PTE LTD.
Reel/Frame 057336/0873 →