IP Library › Assignment 054171/0409
Patent Assignment
Reel/Frame 054171/0409

Assignment of Assignor's Interest

Recorded: 2020-10-27 Pages: 5
Assignors
BOUCHE, GUILLAUME
Executed: 2020-10-19
WEI, ANDY CHIH-HUNG
Executed: 2020-10-26
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95054
Covered Property (1)
Stitching to Enable Dense Interconnect Arrangements
Application: 17/080,880 →
Publication: US 2022/0130758
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Sep 11, 2025
From: INTEL CORPORATION
To: INTEL NDTM US LLC
Reel/Frame 072229/0459 →