IP Library › Assignment 054178/0470
Patent Assignment
Reel/Frame 054178/0470

Assignment of Assignor's Interest

Recorded: 2020-10-27 Pages: 5
Assignors
TAN, KOK WEI
Executed: 2020-10-22
LEE, CHUL NYOUNG
Executed: 2020-10-25
HOI, SIEW KIT
Executed: 2020-10-25
WANG, XINXIN
Executed: 2020-10-25
CHONG, ZHENG MIN CLARENCE
Executed: 2020-10-25
ZHONG, YAOYING
Executed: 2020-10-25
TEO, KOK SEONG
Executed: 2020-10-25
Assignee
APPLIED MATERIALS SINGAPORE TECHNOLOGY PTE. LTD.
8 UPPER CHANGI ROAD NORTH, APPLIED MATERIALS BUILDING, SINGAPORE, 506906, SINGAPORE
Covered Property (1)
Methods and Apparatus for Prevention of Component Cracking Using Stress Relief Layer
Application: 17/072,082 →
Publication: US 2022/0122871
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Oct 27, 2020
From: WADA, YUICHI
To: APPLIED MATERIALS, INC.
Reel/Frame 054177/0186 →
Assignment of Assignor's Interest Feb 4, 2021
From: APPLIED MATERIALS SINGAPORE TECHNOLOGY PTE. LTD.
To: APPLIED MATERIALS, INC.
Reel/Frame 055145/0094 →