Patent Assignment
Reel/Frame 054185/0951
Assignment of Assignor's Interest
Recorded: 2020-10-27
Pages: 2
Assignor
SEO, HYUN CHUL
Executed: 2020-10-07
Assignee
SK HYNIX INC.
2091, GYEONGCHUNG-DAERO, BUBAL-EUB, ICHEON-SI GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Wafer, Method for Separating the Semiconductor Wafer, Semiconductor Chip, and Semiconductor Package Including the Semiconductor Chip