Patent Assignment
Reel/Frame 054267/0137
Assignment of Assignor's Interest
Recorded: 2020-11-04
Pages: 5
Assignors
LIN, YEONG-JYH
Executed: 2020-10-06
LI, CHING I
Executed: 2020-10-07
CHIOU, DE-YANG
Executed: 2020-10-15
CHEN, SZ-FAN
Executed: 2020-10-08
HU, HAN-JUI
Executed: 2020-10-11
WANG, CHING-HUNG
Executed: 2020-10-06
LEE, RU-LIANG
Executed: 2020-10-19
YU, CHUNG-YI
Executed: 2020-10-16
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSIN-CHU SCIENCE PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Photolithography Alignment Process for Bonded Wafers