Patent Assignment
Reel/Frame 054272/0353
Assignment of Assignor's Interest
Recorded: 2020-11-02
Pages: 3
Assignors
KANG, SUNG HYUNG
Executed: 2020-05-06
CHO, JONG HYUN
Executed: 2020-05-06
SONG, MIN SUNG
Executed: 2020-05-06
AN, IL HO
Executed: 2020-05-06
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
MAEYOUNG-RO 150 (MAETAN-DONG), YOUNGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Ceramic Electronic Component Comprising Dielectric Grains Having a Core-Dual Shell Structure and Method of Manufacturing the Same