Patent Assignment
Reel/Frame 054288/0986
Assignment of Assignor's Interest
Recorded: 2020-11-05
Pages: 4
Assignors
DRESCHER, WOLFRAM
Executed: 2020-07-29
RICHTER, JAN
Executed: 2020-06-28
BEYER, CHRISTIAN
Executed: 2020-06-24
Assignee
SILTECTRA GMBH
MANFRED-VON-ARDENNE-RING 7, DRESDEN, 01099, GERMANY
Covered Property
(1)
Combined wafer production method with laser treatment and temperature-induced stresses