Patent Assignment
Reel/Frame 054298/0075
Assignment of Assignor's Interest
Recorded: 2020-11-06
Pages: 3
Assignors
WANG, PEI-YU
Executed: 2019-09-26
CHUNG, CHENG-TING
Executed: 2019-09-26
LEE, WEI JU
Executed: 2019-09-26
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Barrier-Free Interconnect Structure and Manufacturing Method Thereof