Patent Assignment
Reel/Frame 054303/0917
Assignment of Assignor's Interest
Recorded: 2020-11-06
Pages: 8
Assignors
SUZUKAWA, TAKAYUKI
Executed: 2020-09-16
SUGAWAR, IKUO
Executed: 2020-09-16
IRINO, TETSUROU
Executed: 2020-09-16
MATSUURA, MASAHARU
Executed: 2020-09-24
TEZUKA, YUUKI
Executed: 2020-09-23
Assignee
SHOWA DENKO MATERIALS CO., LTD.
9-2, MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO, 100-6606, JAPAN
Covered Property
(1)
Resin Film for Interlayer Insulating Layer with Support, Multilayer Printed Circuit Board, and Method of Manufacturing Multilayer Printed Circuit Board
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.