Patent Assignment
Reel/Frame 054309/0318
Assignment of Assignor's Interest
Recorded: 2020-11-09
Pages: 6
Assignors
JEONG, DAWOON
Executed: 2020-10-08
KIM, YOUNGWOO
Executed: 2020-10-08
KIM, JAESUNG
Executed: 2020-10-08
IN, HYOUNGRYEOL
Executed: 2020-10-08
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
3D Semiconductor Memory Device