Patent Assignment
Reel/Frame 054332/0184
Assignment of Assignor's Interest
Recorded: 2020-11-11
Pages: 2
Assignor
ETO, HIDEO
Executed: 2020-10-26
Assignee
KIOXIA CORPORATION
1-21, SHIBAURA 3-CHOME, MINATO-KU, TOKYO, JAPAN
Covered Property
(1)
Bonding Apparatus and Bonding Method