Patent Assignment
Reel/Frame 054337/0146
Assignment of Assignor's Interest
Recorded: 2020-11-11
Pages: 7
Assignors
KANG, HYEONGMUN
Executed: 2020-07-27
KO, JUNGMIN
Executed: 2020-07-27
BAEK, SEUNGDUK
Executed: 2020-08-13
KIM, TAEHYEONG
Executed: 2020-08-07
SHIN, INSUP
Executed: 2020-07-27
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU,, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package and Method of Manufacturing the Same