Patent Assignment
Reel/Frame 054342/0757
Assignment of Assignor's Interest
Recorded: 2020-11-12
Pages: 5
Assignors
KUAN, CHIN LEE
Executed: 2020-09-07
KUAN, BOK ENG
Executed: 2020-09-07
KONG, JACKSON CHUNG PENG
Executed: 2020-09-05
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BLVD, SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Stepped Interposer for Stacked Chip Package