Patent Assignment
Reel/Frame 054359/0863
Assignment of Assignor's Interest
Recorded: 2020-11-13
Pages: 8
Assignors
LIANG, CHIN-WEI
Executed: 2020-06-16
CHEN, SHENG-CHAU
Executed: 2020-07-06
KUANG, HSUN-CHUNG
Executed: 2020-06-20
LI, SHENG-CHAN
Executed: 2020-07-06
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSIN-CHU SCIENCE PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Bond Pad Structure for Bonding Improvement