Patent Assignment
Reel/Frame 054388/0635
Assignment of Assignor's Interest
Recorded: 2020-11-17
Pages: 7
Assignors
CHOI, JU-IL
Executed: 2020-10-20
PARK, JUMYONG
Executed: 2020-10-20
AN, JIN HO
Executed: 2020-10-21
LEE, CHUNGSUN
Executed: 2020-10-14
JEONG, TEAHWA
Executed: 2020-10-21
JIN, JEONGGI
Executed: 2020-10-20
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, GYEONGGI-DO, SUWON-SI, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Interconnection Structure and Semiconductor Package Including the Same