Patent Assignment
Reel/Frame 054400/0783
Assignment of Assignor's Interest
Recorded: 2020-11-18
Pages: 4
Assignors
TIEN, HSI-WEN
Executed: 2020-09-29
LEE, CHUNG-JU
Executed: 2020-09-29
LU, CHIH WEI
Executed: 2020-09-29
YAO, HSIN-CHIEH
Executed: 2020-09-29
DAI, YU-TENG
Executed: 2020-09-29
LIAO, WEI-HAO
Executed: 2020-09-29
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSIN-CHU SCIENCE PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Selective Deposition of a Protective Layer to Reduce Interconnect Structure Critical Dimensions