Patent Assignment
Reel/Frame 054408/0874
Assignment of Assignor's Interest
Recorded: 2020-11-18
Pages: 3
Assignors
YANG, YI
Executed: 2018-05-30
SHEN, DONGNA
Executed: 2018-05-31
WANG, YU-JEN
Executed: 2018-05-31
Assignee
HEADWAY TECHNOLOGIES, INC.
678 SOUTH HILLVIEW DRIVE, MILPITAS, CALIFORNIA, 95035
Covered Property
(1)
Under-Cut via Electrode for Sub 60NM Etchless Mram Devices by Decoupling the via Etch Process
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.