Patent Assignment
Reel/Frame 054414/0261
Assignment of Assignor's Interest
Recorded: 2020-11-19
Pages: 5
Assignors
ISHIKAWA, SHINYA
Executed: 2020-10-27
ONO, KENTA
Executed: 2020-10-27
HONDA, MASANOBU
Executed: 2020-10-28
Assignee
TOKYO ELECTRON LIMITED
3-1, AKASAKA 5-CHOME, MINATO-KU,, TOKYO, 107-6325, JAPAN
Covered Property
(1)
Etching Method, Substrate Processing Apparatus, and Substrate Processing System