IP Library Assignment 054443/0632
Patent Assignment
Reel/Frame 054443/0632

Assignment of Assignor's Interest

Recorded: 2020-11-23 Pages: 8
Assignors
DELACRUZ, JAVIER A.
Executed: 2020-11-03
HABA, BELGACEM
Executed: 2018-06-28
UZOH, CYPRIAN EMEKA
Executed: 2018-06-28
KATKAR, RAJESH
Executed: 2018-08-09
MOHAMMED, ILYAS
Executed: 2018-06-27
Assignee
XCELSIS CORPORATION
3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Property (1)
Systems and Methods for Releveled Bump Planes for Chiplets
Application: 17/100,007 →
Publication: US US20210175206A1
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Nov 19, 2025
From: XCELSIS CORPORATION
To: ADEIA SEMICONDUCTOR INC.
Reel/Frame 073635/0460 →