Patent Assignment
Reel/Frame 054458/0901
Assignment of Assignor's Interest
Recorded: 2020-11-24
Pages: 2
Assignor
MIZUTA, YOSHIO
Executed: 2020-10-06
Assignee
KIOXIA CORPORATION
1-21, SHIBAURA 3-CHOME, MINATO-KU, TOKYO, JAPAN
Covered Property
(1)
Bonding Apparatus, Bonding Method, and Method for Manufacturing Semiconductor Device