Patent Assignment
Reel/Frame 054473/0813
Assignment of Assignor's Interest
Recorded: 2020-11-25
Pages: 3
Assignors
WANG, PU
Executed: 2020-11-03
CHENG, LI-HUI
Executed: 2020-11-03
LU, SZU-WEI
Executed: 2020-11-03
TSAI, TSUNG-FU
Executed: 2020-11-03
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Package Structure and Method of Manufacturing the Same