Patent Assignment
Reel/Frame 054478/0457
Assignment of Assignor's Interest
Recorded: 2020-11-27
Pages: 11
Assignors
CHEN, WILLIAM T.
Executed: 2020-11-26
HUNT, JOHN RICHARD
Executed: 2017-09-29
HUNG, CHIH-PIN
Executed: 2017-10-03
WANG, CHEN-CHAO
Executed: 2017-10-03
HUANG, CHIH-YI
Executed: 2017-10-02
Assignee
ADVANCED SEMICONDUCTOR ENGINEERING, INC.
26 CHIN 3RD ROAD, NANTZE EXPORT PROCESSING ZONE, KAOHSIUNG, TAIWAN
Covered Property
(1)
Stacked Semiconductor Package Assemblies Including Double Sided Redistribution Layers