Patent Assignment
Reel/Frame 054488/0507
Assignment of Assignor's Interest
Recorded: 2020-11-30
Pages: 9
Assignors
SHEN, YU-YANG
Executed: 2019-05-09
TSENG, CHIEN-HSIEN
Executed: 2019-05-09
YAUNG, DUN-NIAN
Executed: 2019-05-09
CHENG, NAI-WEN
Executed: 2019-05-09
CHEN, PAO-TUNG
Executed: 2019-05-09
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSIN-CHU SCIENCE PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Ion Through-Substrate Via