Patent Assignment
Reel/Frame 054497/0343
Assignment of Assignor's Interest
Recorded: 2020-12-01
Pages: 5
Assignors
HSIEH, CHENG-YEN
Executed: 2020-11-12
YU, CHUN-HUI
Executed: 2020-11-12
HUANG, PING-KANG
Executed: 2020-11-12
CHIU, SAO-LING
Executed: 2020-11-12
WANG, YI-JHANG
Executed: 2020-11-12
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 30078, TAIWAN
Covered Property
(1)
Semiconductor Packages and Methods of Forming the Same