Patent Assignment
Reel/Frame 054504/0914
Assignment of Assignor's Interest
Recorded: 2020-12-01
Pages: 5
Assignors
LEE, SHAO-KUAN
Executed: 2020-11-10
TSAI, CHERNG-SHIAW
Executed: 2020-11-10
LO, TING-YA
Executed: 2020-11-10
LEE, CHENG-CHIN
Executed: 2020-11-10
TENG, CHI-LIN
Executed: 2020-11-10
CHENG, KAI-FANG
Executed: 2020-11-10
HUANG, HSIN-YEN
Executed: 2020-11-10
CHANG, HSIAO-KANG
Executed: 2020-11-10
SHUE, SHAU-LIN
Executed: 2020-11-12
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Thermal Interconnect Structure for Thermal Management of Electrical Interconnect Structure