Assignment of Assignor's Interest

Recorded: 2020-12-02 Pages: 4

Assignors

BIN ABDULLAH, MOHD MUHAIYIDDIN

Executed: 2020-10-01

LOH, LEE PING

Executed: 2020-10-01

TEH, PHEAK TI

Executed: 2020-10-01

LIM, KEN BENG

Executed: 2020-10-01

Assignee

INTEL CORPORATION

2200 MISSION COLLEGE BLVD., SANTA CLARA, CALIFORNIA, 95054

Covered Property (1)

Conductive Polygon Power and Ground Interconnects for Integrated-Circuit Packages

Application: 17/030,080 →

Publication: US 2021/0183758

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.