Patent Assignment
Reel/Frame 054523/0028
Assignment of Assignor's Interest
Recorded: 2020-12-03
Pages: 4
Assignors
CHU, YUNG-CHI
Executed: 2020-10-26
KUO, HUNG-JUI
Executed: 2020-11-20
HU, YU-HSIANG
Executed: 2020-11-20
LIAO, SIH-HAO
Executed: 2020-11-20
HU, TIAN
Executed: 2020-11-20
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
A Sensing Component Encapsulated by an Encapsulation Layer with a Roughness Surface Having a Hollow Region